Using the extremely accurate precision of silicon micro machining, optical components and chips can be hybridly integrated on a silicon substrate with very high alignment accuracy.

The silicon boards contains machined features, such as grooves and cavities, together with metal pads for electrical contact and solder pads.

Typical optical components to be integrated are fibers, laser chips, detectors, mirrors, ball lenses, or splitters.

Customized solutions for fiber-chip connectors are offered

Typical Specifications

• Submicron alignment
• System area: mm² to cm²
• Components: area > 2x2 mm²
• System area: mm² to cm²
• Temperature: 10-60 C°

Typical Applications

• Chip to chip / chip to board
• Fiber to chip
• System integration
• Telecommunication